question: Will a black-anodized aluminum heatsink dissipate heat better than clear-anodized? If so, why?
comment: It will do worse. Anodization creates a protective oxide layer which is less conductive than aluminium. Clear anodization has the thinnest layer while black anodization uses a much thicker layer.
passages: Aluminum is typically clad on both the inside and the exterior pan surfaces, providing both a stainless cooking surface and a stainless surface to contact the cooktop. Copper of various thicknesses is often clad on its interior surface only, leaving the more attractive copper exposed on the outside of the pan (see Copper above).
   Section::::Other widely used specifications.:Organic acid.
  
  Anodizing can produce yellowish integral colors without dyes if it is carried out in weak acids with high voltages, high current densities, and strong refrigeration. Shades of color are restricted to a range which includes pale yellow, gold, deep bronze, brown, grey, and black. Some advanced variations can produce a white coating with 80% reflectivity. The shade of color produced is sensitive to variations in the metallurgy of the underlying alloy and cannot be reproduced consistently.
   The metal tab is often connected electrically to the internal circuitry. This does not normally pose a problem when using isolated heatsinks, but an electrically-insulating pad or sheet may be required to electrically isolate the component from the heatsink if the heatsink is electrically conductive, grounded or otherwise non-isolated. Many materials may be used to electrically isolate the TO-220 package, some of which have the added benefit of high thermal conductivity.
  
  In applications that require a heatsink, damage or destruction of the TO-220 device due to overheating may occur if the heatsink is dislodged during operation.
   In 2014 All-Clad partnered with Chef Thomas Keller to produce the All-Clad TK that feature bonded aluminum and stainless with a copper core.
  
  Section::::United States patents.
  
  At the time of its founding, All-Clad used a patented "roll bonding" process by which metals are sandwiched together and then formed into a cooking vessel. The company derived its name from this cladding process, which is applied not only on the bottom but extends all the way up the sides of each cooking vessel. The company has been issued several patents by the United States Patent and Trademark Office (USPTO).
  
  Section::::Production.
   EEStor's US patent 7033406 mentions aluminum oxide and calcium magnesium aluminosilicate glass as coatings, although their subsequent US patent 7466536 mentions only aluminum oxide. Nickel was mentioned in the earlier US patent as the electrode but the later patent uses 1 μm aluminum plates as a less expensive alternative. According to the patents, both changes were made possible by selecting the PET matrix because it is pliable enough to fill voids at only 180 °C.
   BULLET::::13. Painted anodized 24ST panels, with paint schedules utilizing good grades of aluminum-pigmented varnishes conforming to Navy Department Specification V10, V11 or 52V15b, were in excellent condition after 2 years of exposure.
   Anodized coatings have a much lower thermal conductivity and coefficient of linear expansion than aluminium. As a result, the coating will crack from thermal stress if exposed to temperatures above 80 °C (353 K). The coating can crack, but it will not peel. The melting point of aluminium oxide is 2050 °C (2323 K), much higher than pure aluminium's 658 °C (931 K). This and the non-conductivity of aluminum oxide can make welding more difficult.
   Some heat sinks for older sockets are not compatible. However, some cooler manufacturers are reported to be offering brackets allowing previously manufactured coolers to work with AM4, while other coolers will be redesigned. Alternatively, some motherboard makers are including both AM3 and AM4 cooler mounting holes, allowing previous generation coolers to be used.
  
  Section::::Chipsets.
   If more heat needs to be dissipated, devices in the also widely used TO-247 (or TO-3P) package can be selected. TO-3P has a typical junction-to-ambient (heatsink) thermal resistance of only about 40 °C/W, and its TO-3PF variant a slightly lower one. Further increase of heat dissipation capability is possible with power modules.
  
  When a TO-220 package is used without a heatsink, the package acts as its own heatsink, and the heatsink-to-ambient thermal resistance in air for a TO-220 package is approximately 70 °C/W.
  
  Section::::Variations.
   Section::::Considerations and mitigation.
   Ideally, heat sinks are made from a good thermal conductor such as silver, gold, copper, or aluminum alloy. Copper and aluminum are among the most-frequently used materials for this purpose within electronic devices. Copper (401 W/(m·K) at 300 K) is significantly more expensive than aluminum (237 W/(m·K) at 300 K) but is also roughly twice as efficient as a thermal conductor. Aluminum has the significant advantage that it can be easily formed by extrusion, thus making complex cross-sections possible. Aluminum is also much lighter than copper, offering less mechanical stress on delicate electronic components. Some heat sinks made from aluminum have a copper core as a trade off. Semiconductors with the highest thermal conductivity are boron arsenide (1300 W/(m·K)) and boron phosphide (500 W/(m·K)). The heat sink's contact surface (the base) must be flat and smooth to ensure the best thermal contact with the object needing cooling. Frequently a thermally conductive grease is used to ensure optimal thermal contact; such compounds often contain colloidal silver. Further, a clamping mechanism, screws, or thermal adhesive hold the heat sink tightly onto the component, but specifically without pressure that would crush the component.
   Hot plate welding can be used to join some combinations of dissimilar thermoplastics. Typically, semi-crystalline plastics are only compatible with semi-crystalline plastics, and amorphous plastics are only compatible with amorphous plastics. If the plastics have the same melting point and melt viscosity, conventional or high-temperature hot plate welding can be used. With different melting points or different viscosities, dual hot plates should be used, with each hot plate set to a different temperature. Common thermoplastic combinations include:
  
  BULLET::::- ABS – PMMA
  
  BULLET::::- ABS – PC
  
  BULLET::::- ABS – SAN
  
  BULLET::::- PMMA – PC + ABS
   The firm purchases some of its metals from United States-based suppliers, including Pennsylvania Steel Company.
  
  Section::::Cookware.
  
  Section::::Cookware.:Interior finishes.
  
  The cooking surface is made from Type 304 stainless steel. Some products include a nonstick coating on top of the stainless steel.
  
  All stainless steel used by the company is certified to meet ISO 9000 and ASTM A240 standards for type 304 stainless steel intended for use with food.
  
  Section::::Cookware.:Exterior finishes.
  
  The cookware is available in a combination of exterior metal finishes including stainless steel, brushed stainless steel, brushed aluminium alloy, black hardcoat anodized aluminium, copper, and copper core.
  
  Section::::Semiannual factory sale.
   Section::::Brazing and soldering.
   Section::::Cleaning.
  
  Anodized aluminium surfaces that are not regularly cleaned are susceptible to panel edge staining, a unique type of surface staining that can affect the structural integrity of the metal.
  
  Section::::Environmental impact.
   Anodized aluminium has had the naturally occurring layer of aluminium oxide thickened by an electrolytic process to create a surface that is hard and non-reactive. It is used for sauté pans, stockpots, roasters, and Dutch ovens.
  
  Uncoated and un-anodized aluminium can react with acidic foods to change the taste of the food. Sauces containing egg yolks, or vegetables such as asparagus or artichokes may cause oxidation of non-anodized aluminium.
   Cladding is a technique for fabricating pans with a layer of efficient heat conducting material, such as copper or aluminum, covered on the cooking surface by a non-reactive material such as stainless steel, and often covered on the exterior aspect of the pan ("dual-clad") as well. Some pans feature a copper or aluminum interface layer that extends over the entire pan rather than just a heat-distributing disk on the base. Generally, the thicker the interface layer, especially in the base of the pan, the more improved the heat distribution. Claims of thermal efficiency improvements are, however, controversial, owing in particular to the limiting and heat-banking effect of stainless steel on thermal flows.
   If using thermally oxidized wafers without a glass layer, the diffusion of OH and H ions instead of Na ions leads to the bonding.
  
  Section::::Procedural steps of anodic bonding.:Cooling down the substrate.
  
  After the bonding process, slow cooling over several minutes has to take place. This can be supported by purging with an inert gas. The cooling time depends on the difference of CTE for the bonded materials: the higher the CTE difference, the longer the cooling period.
   In terms of styling, the amplifiers up until 1989 are constructed of heavy aluminium extruded cases that act as heat sinks; these were painted black with a metallic silver brim – thus nicknamed "chrome bumper" range. The pre-amplifiers are housed in "half-size" while most of the power amplifier range was housed in full-size cases. In 1989, the range was given a new look using the same sturdy aluminium cases but with a new olive-coloured fascia panel which also had a back-lit logo. Another facelift for the range came in 2002. The 2013 range of Naim equipment has aluminium chassis and sleeves; the fascia is die-cast zinc.
   Copper is three times as dense and more expensive than aluminium. One-piece copper heat sinks can be made by skiving or milled. Sheet-metal fins can be soldered onto a rectangular copper body. Copper is less ductile than aluminium, so it cannot be extruded into heat sinks.
  
  Section::::Design factors.:Material.:Fin efficiency.
   Unlike the older AA-1350 alloy previously used, these AA-8000 series alloys also retain their tensile strength after the standard current cycle test or the Current Cycle Submersion Test (CCST), as described in ANSI C119.4:2004. Depending on the annealing grade, AA-8176 may elongate up to 30% with less springback effect and possesses a higher yield strength ( for a cold worked AA-8076 wire).
   A heatsinked TO-220 package dissipating 1 W of heat will have an internal (junction) temperature typically 2 to 5 °C higher than the package's temperature (due to the thermal resistance between the junction and the metal tab), and the metal tab of the TO-220 package will typically have a temperature 1 to 60 °C higher than the ambient temperature, depending on the type of heatsink (if any) used.
   Section::::Specific cases.:Electroless nickel plating.
  
  Electroless nickel plating, also known as "enickel" and "NiP", offers many advantages: uniform layer thickness over most complicated surfaces, direct plating of ferrous metals (steel), superior wear and corrosion resistance to electroplated nickel or chrome. Much of the chrome plating done in aerospace industry can be replaced with electroless nickel plating, again environmental costs, costs of hexavalent chromium waste disposal and notorious tendency of uneven current distribution favor electroless nickel plating.
   As an example, Minolta offered the PC terminal adapter PCT-100 (8825-691) for this purpose, which worked as a galvanic isolator and could withstand 400 volts DC or AC. The similar Sony flash sync terminal and ISO hotshoe adapters FA-ST1AM and FA-HS1AM also offer galvanic isolation as well, but only up to 60 volts DC or AC.
   The dual finishing process uses the best each process has to offer, anodizing with its hard wear resistance and chromate conversion coating with its electrical conductivity.
  
  The process steps can typically involve chromate conversion coating the entire component, followed by a masking of the surface in areas where the chromate coating must remain intact. Beyond that, the chromate coating is then dissolved in unmasked areas. The component can then be anodized, with anodizing taking to the unmasked areas. The exact process will vary dependent on service provider, component geometry and required outcome.
  
  Section::::Other widely used specifications.
  