question: How come is possible to have different versions of extremely high level stuff made for the same purpose ?
comment: You are describing *mature technology.* When a problem has been understood for a very long time, and the situation has not changed, everyone arrives at a best solution that doesn't vary much. For example, the concrete used to pave streets is fairly similar in most places. But things like moon rockets have only been done a few times, and even during that period the available tools (like computers) and materials (like metal alloys) have advanced. So the perfecting is just not done.
passages: Although very successful, JET and its counterpart TFTR failed to reach breakeven. This was due to a variety of effects that had not been seen in previous machines operating at lower densities and pressures. Based on these results, and a number of advances in plasma shaping and diverter design, a new tokamak layout emerged, sometimes known as an "advanced tokamak". An advanced tokamak capable of reaching breakeven would have to be very large and very expensive, which led to the international effort ITER.
   Multi-project wafer service
  
  Multi-project chip (MPC), also known as multi-project wafer (MPW), services integrate onto microelectronics wafers a number of different integrated circuit designs from various teams including designs from private firms, students and researchers from universities. Because IC fabrication costs are extremely high, it makes sense to share mask and wafer resources to produce designs in low quantities. Worldwide, several MPW services are available from government-supported institutions or from private firms including Canadian Microelectronics Corporation (CMC), MOSIS, CMP, Europractice, eSilicon, WaferCatalyst, and Muse Semiconductor . 
   HLA was initiated in the early 1990’s when Dr. Anita K. Jones, the Director of Defense Research and Engineering within the US Department of Defense, gave the Defense Modeling and Simulation Office (DMSO) the task of “assuring interoperability and reusability of defense models and simulations”. In 1995 DMSO formulated a vision for modeling and simulation and established a modeling and simulation masterplan, which included the High-level Architecture. 
   At a similar time to the publication of the report by Northrop and others, a research and training initiative was being initiated in the UK on Large-scale Complex IT Systems. Many of the challenges recognized in this initiative were the same as, or were similar to those recognized as the challenges of ultra-large-scale systems. Greg Goth quotes Dave Cliff, director of the UK initiative as saying "The ULSS proposal and the LSCITS proposal were written entirely independently, yet we came to very similar conclusions about what needs to be done and about how to do it". A difference pointed out by Ian Sommerville is that the UK initiative began with a 5 to 10 year vision, while that of Northrop and her co-authors was much longer term. This seems to have led to there being two slightly different perspectives on ultra-large-scale systems. For example, Richard Gabriel's perspective is that ultra-large-scale systems are desirable but currently impossible to build due to limitations in the fields of software design and systems engineering. On the other hand, Ian Sommerville's perspective is that ultra-large-scale systems are already emerging (for example in air traffic control), the key problem being not how to achieve them but how to ensure they are adequately engineered.
   It was not long before the other labs began agitating for their own funding. Tuck had managed to arrange some funding for his Perhapsatron through some discretionary budgets at LANL, but other teams at LANL, Berkeley and Oak Ridge (ORNL) also presented their ideas. The DOE eventually organized a new department for all of these projects, becoming "Project Sherwood".
  
  Section::::History.:Early devices.
   Through the mid-1980s the reasons for many of these problems became clear, and various solutions were offered. However, these would significantly increase the size and complexity of the machines. A follow-on design incorporating these changes would be both enormous and vastly more expensive than either JET or TFTR. A new period of pessimism descended on the fusion field.
  
  Section::::History.:ITER.
   In addition, there have been advances in the development of non-virtualization MSL systems through the use of specialized hardware, resulting in at least one viable solution:
  
  BULLET::::- The Starlight Technology (now marketed as the Interactive Link System), developed by the Australian Defence Science Technology Organisation (DSTO) and Tenix Pty Ltd, uses specialized hardware to allow users to interact with a "Low" network from a "High" network session within a window, without any data flowing from the "High" to the "Low" network.
  
  Section::::Philosophical aspects, ease of use, flexibility.
   Jean-Yves Leclerc was a computer designer who was unable to find funding in Europe for a high-performance server design. In 1985 he visited Dave Evans, his former PhD. adviser, looking for advice. After some discussion he eventually convinced him that since most of their customers were running E&S graphics hardware on Cray Research machines and other supercomputers, it would make sense if E&S could offer their own low-cost platform instead.
   Section::::Advances in MSL.
   In 2011, several projects aiming at developing technologies and software for exascale computing were started in the EU. The CRESTA project (Collaborative Research into Exascale Systemware, Tools and Applications), the DEEP project (Dynamical ExaScale Entry Platform), and the project Mont-Blanc. A major European project based on exascale transition is the MaX (Materials at the Exascale) project.
   “In the past, factory managers had their office overlooking the factory so that they could get a feel for what was happening on the factory floor. With the digital twin, not only the factory manager, but everyone associated with factory production could have that same virtual window to not only a single factory, but to all the factories across the globe.” (Grieves, 2014, p. 5)
  
  Section::::The characteristics of digital twin technology.:Reprogrammable and Smart.
   The first methods for rapid prototyping became available in the late 1980s and were used to produce models and prototype parts. Today, they are used for a wide range of applications and are used to manufacture production-quality parts in relatively small numbers if desired without the typical unfavorable short-run economics. This economy has encouraged online service bureaus. Historical surveys of RP technology start with discussions of simulacra production techniques used by 19th-century sculptors. Some modern sculptors use the progeny technology to produce exhibitions. The ability to reproduce designs from a dataset has given rise to issues of rights, as it is now possible to interpolate volumetric data from one-dimensional images.
   A large part of the site was dedicated to manufacturing. It is now very rare that companies manufacture their own products due to the complex nature of multiple layer circuit boards containing high density surface mounted components. It is more common now to design complex circuits on a computer and await delivery of a ready built board or simply use off the shelf IT.
   Standalone programs are now mainly limited to SoC's or Microcontrollers (where battery life, price, and data space are at premiums) and critical systems. In extreme cases every possible set of inputs and errors must be tested and thus every potential output known; fully independent [separate physical suppliers and programing teams] yet fully parallel system-state monitoring; or where the attack surface must be minimized; an operating system would add unacceptable complexity and uncertainty.
   In 2017 and 2018, Michael led the prototyping lab at Google X, where he led his own moonshot investigation and collaborated to pioneer the future of automated manufacturing. 
  
  Section::::Early life and education.
   The next products to be designed and built were the Laser Chorus and Dataflash. Laser Chorus was a multiple-head laser system with 4.9-milliwatt gas laser tubes available in red, yellow, green, and orange. The heads were controlled by a microprocessor-based controller and they were capable of producing effects such as tunnels, planes, and various other geometric shapes and patterns. Because they were not over 5 milliwatts they were Class IIIA lasers and did not require a variance to operate in most states in the U.S.
   New circuit boards in turn contain large Field Programmable Gate Array chips which can be programmed when a device starts up. This can create a single circuit board which previously would have been made up of a larger amount of chips across more boards all requiring manufacturing and testing with increased cost.
  
  Section::::Headquarters and manufacturing.:Effect Systems Limited.
   Production in Germany was ceased in 2015 when due to high costs production was relocated to Malaysia. At the same year, a manufacturing facility was opened in South Korea. In 2017, in cooperation with Kalyon Enerji manufacturing was started in Turkey and in 2019 in the United States. In 2018, the wafer production was closed in China while a new wafer production facility was opened in 2019 in Malaysia. The cooperation in Turkey was ended in 2019.
   New materials and methods of construction have increased the quality and power of the magnetic fields, improving performance. A number of new devices have been built to test these concepts. Major examples include Wendelstein 7-X in Germany, the Helically Symmetric Experiment (HSX) in the USA, and the Large Helical Device in Japan. W7X and LHD use superconducting magnetic coils.
   There are always smaller firms (SMEs) who are inadequately situated to finance the development of innovative R&D in the post-research and early technology phases. By sharing incipient technology under certain conditions, substantial risk financing can come from third parties. This is a form of quasi-licensing which takes different formats. Even large corporates may not wish to bear all costs of development in areas of significant and high risk (e.g. aircraft development) and may seek means of spreading it to the stage that proof-of-concept is obtained.
   Manufacturers have long employed analogous engineering techniques to create a product line of similar products using a common factory that assembles and configures parts designed to be reused across the product line. For example, automotive manufacturers can create unique variations of one car model using a single pool of carefully designed parts and a factory specifically designed to configure and assemble those parts.
   Section::::The birth of a new industry.
   After review of these two contracts by the DoE, it was determined that the development of fusion power be left in the hands of the national labs. These labs had the resources, including computer systems and expensive laser systems, to have the best shot at producing laser fusion. The DoE suggested that KMS Fusion should still investigate target fabrication and laser-target interactions. The DoE saw KMS Fusion involved by “commercial mass production of laser fusion targets” and that is what they did for the national labs that could not make their own targets. KMS Fusion was involved in this role until they went under in 1993 after competition for a new DoE contract was opened.
   Multiple patterning with immersion scanners can be expected to have higher wafer productivity than EUV, even with as many as 4 passes per layer, due to faster wafer exposure throughput (WPH), a larger number of tools being available, and higher uptime.
  
  Section::::Multipatterning Implementations.:Multiple patterning specific issues.
   BULLET::::- Some modules have been rumored to cost as much as US$15 million.
  
  BULLET::::- With 4 different module versions cost per module can vary by as much as US$5 million.
  
  BULLET::::- At least 30% of the cost of each module is related to the still exotic metallurgy and metalworking requirements needed to construct each module.
  
  BULLET::::- Because of the costly and complex metallurgy construction requirements, ALLISS technology is 'off limits' to many developing nations including even a few advanced nations in the developed world.
  
  Section::::Technology FAQ (overview).:Versions of ALLISS modules.
  