Instruct: Identify the main and secondary category of Arxiv papers based on the titles and abstracts
Query: Reduced etch lag and high aspect ratios by deep reactive ion etching
  (DRIE)   Deep reactive ion etching (DRIE) with the Bosch process is one of the key
procedures used to manufacture micron-sized structures for MEMS and
microfluidic applications in silicon and, hence, of increasing importance for
miniaturization in biomedical research. While guaranteeing high aspect ratio
structures and providing high design flexibility, the etching procedure suffers
from reactive ion etching lag and often relies on complex oxide masks to enable
deep etching. In this work, we introduce an optimized Bosch process that
reduces the etch lag to below 1.5 %. Furthermore, we improved a three-step
Bosch process, allowing the fabrication of structures with 6 micrometre
thickness at depths up to 180 micrometre while maintaining their stability.

20
The categories of this paper are: acc-phys
8
The categories of this paper are: hep-ex
11
The categories of this paper are: hep-lat
18
The categories of this paper are: econ
35
The categories of this paper are: mtrl-th
26
The categories of this paper are: bayes-an
1
The categories of this paper are: cs
27
The categories of this paper are: comp-gas
12
The categories of this paper are: nucl-th
32
The categories of this paper are: atom-ph
4
The categories of this paper are: cond-mat
22
The categories of this paper are: chao-dyn
2
The categories of this paper are: math
15
The categories of this paper are: nucl-ex
5
The categories of this paper are: gr-qc
10
The categories of this paper are: q-bio