<human>: Question: When did surface-mount become a commonly used manufacturing process?
Answer: Surface mount components can be about one-quarter to one-tenth of the size and weight of through-hole components, and passive components much cheaper; prices of semiconductor surface mount devices (SMDs) are determined more by the chip itself than the package, with little price advantage over larger packages.
 Is the question answered in a satisfactory fashion?

OPTIONS:
- yes
- no
<bot>: no